Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Domain | Definition |
Occupations | Tends sawing machine that automatically scribes semiconductor wafers prior to separating wafers into individual $T3dies$T1: Flips switches and presses buttons to activate sawing machine. Places wafer mounted on laminated plastic onto moveable chuck of sawing machine, using tweezers. Presses buttons and turns knobs and dials to adjust saw to specifications and to start sawing cycle. Monitors sawing cycle, using magnified viewer or TV monitor, to verify that wafers are scribed according to specifications and adjusts controls if required. Removes scribed wafer from machine and places wafer in container, using tweezers. May mount wafers on plastic laminate, using mounting device. May visually inspect wafers to identify misalignment of scribe lines. May maintain and clean sawing machine. May separate sawn wafers into dies [WAFER BREAKER, SEMICONDUCTORS (electron. comp.) 726.687-046]. May clean sawn wafers or dies, using cleaning equipment and solutions. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)53 41 57 4F 50 45 52 41 54 4F 52 2C 53 45 4D 49 43 4F 4E 44 55 43 54 4F 52 57 41 46 45 52 53 |
| Leonardo da Vinci (1452-1519; backwards) (references)
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Binary Code (1918-1938, probably earlier) (references)01010011 01000001 01010111 00100000 01001111 01010000 01000101 01010010 01000001 01010100 01001111 01010010 00101100 00100000 01010011 01000101 01001101 01001001 01000011 01001111 01001110 01000100 01010101 01000011 01010100 01001111 01010010 00100000 01010111 01000001 01000110 01000101 01010010 01010011 |
HTML Code (1990) (references)S A W   O P E R A T O R ,   S E M I C O N D U C T O R   W A F E R S |
ISO 10646 (1991-1993) (references)0053 0041 0057 004F 0050 0045 0052 0041 0054 004F 0052 002C 0053 0045 004D 0049 0043 004F 004E 0044 0055 0043 0054 004F 0052 0057 0041 0046 0045 0052 0053 |
Encryption (beginner's substitution cypher): (references)53355724950395235544952142533947433749483855375449522573540395253 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
