Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Domain | Definition |
Occupations | Assembles layers of laminating materials and printed circuit board (PCB) panels to prepare for multilayer PCB laminating process: Assembles and aligns inner and outer layers of PCB panels and laminating materials over guide pins in holding fixture to prepare multilayer PCB panels for laminating process, following established procedures. Examines inner layers of panels during assembly for defects, such as chips, dust, or dents. May tend laminating machine that bonds assembled panels to form multilayer PCB panels [LAMINATOR, PRINTED CIRCUIT BOARDS (electron. comp.) 692.685-282]. May heat materials in oven to remove moisture prior to laminating process. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)4C 41 4D 49 4E 41 54 49 4F 4E 41 53 53 45 4D 42 4C 45 52 2C 50 52 49 4E 54 45 44 43 49 52 43 55 49 54 42 4F 41 52 44 53 |
| Leonardo da Vinci (1452-1519; backwards) (references)
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Binary Code (1918-1938, probably earlier) (references)01001100 01000001 01001101 01001001 01001110 01000001 01010100 01001001 01001111 01001110 00100000 01000001 01010011 01010011 01000101 01001101 01000010 01001100 01000101 01010010 00101100 00100000 01010000 01010010 01001001 01001110 01010100 01000101 01000100 00100000 01000011 01001001 01010010 01000011 01010101 01001001 01010100 00100000 01000010 01001111 01000001 01010010 01000100 01010011 |
HTML Code (1990) (references)L A M I N A T I O N   A S S E M B L E R ,   P R I N T E D   C I R C U I T   B O A R D S |
ISO 10646 (1991-1993) (references)004C 0041 004D 0049 004E 0041 0054 0049 004F 004E 0041 0053 0053 0045 004D 0042 004C 0045 0052 002C 0050 0052 0049 004E 0054 0045 0044 0043 0049 0052 0043 0055 0049 0054 0042 004F 0041 0052 0044 0053 |
Encryption (beginner's substitution cypher): (references)463547434835544349482355353394736463952142505243485439382374352375543542364935523853 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
