Copyright © Philip M. Parker, INSEAD. Terms of Use.

| Domain | Definition |
Occupations | Immerses semiconductor wafers in series of chemical baths to etch circuitry patterns into or to strip excess photoresist from wafer surfaces: Places semiconductor wafers in containers, such as boats or cassettes, using vacuum wand or tweezers. Immerses loaded containers in series of chemical and water baths to etch circuitry patterns into or strip excess photoresist from wafer surfaces. Places loaded container into air or spin dryer and pushes buttons to activate drying cycle. May visually inspect etched and stripped wafer, using microscope, to detect scratches, contaminants, and to verify conformance to specifications. May tend plasma (gas) etch machine to etch circuitry patterns into wafer surfaces. May clean and maintain chemical baths. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)45 54 43 48 45 52 2D 53 54 52 49 50 50 45 52 2C      53 45 4D 49 43 4F 4E 44 55 43 54 4F 52      57 41 46 45 52 53 |
| Leonardo da Vinci (1452-1519; backwards) (references)
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Binary Code (1918-1938, probably earlier) (references)01000101 01010100 01000011 01001000 01000101 01010010 00101101 01010011 01010100 01010010 01001001 01010000 01010000 01000101 01010010 00101100 00100000 01010011 01000101 01001101 01001001 01000011 01001111 01001110 01000100 01010101 01000011 01010100 01001111 01010010 00100000 01010111 01000001 01000110 01000101 01010010 01010011 |
HTML Code (1990) (references)E T C H E R - S T R I P P E R ,   S E M I C O N D U C T O R   W A F E R S |
ISO 10646 (1991-1993) (references)0045 0054 0043 0048 0045 0052 002D 0053 0054 0052 0049 0050 0050 0045 0052 002C      0053 0045 004D 0049 0043 004F 004E 0044 0055 0043 0054 004F 0052      0057 0041 0046 0045 0052 0053 |
Encryption (beginner's substitution cypher): (references)395437423952155354524350503952142533947433749483855375449522573540395253 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.