Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Domain | Definition |
Occupations | Tends equipment that chemically cleans semiconductor wafers used in manufacture of semiconductor components, such as transistors, diodes, and integrated circuits: Places specified program card into cleaning equipment. Places wafers in cleaning trays, using tweezers. Loads trays into cleaning equipment. Pours cleaning solutions, such as hydrogen peroxide, sulfuric acid, and hydrochloric acid into specified tank of cleaning equipment. Presses buttons to activate cleaning cycle. Removes semiconductor wafers from trays, using tweezers. Visually inspects semiconductor wafers for blemishes. Maintains production reports. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)43 4C 45 41 4E 49 4E 47 4D 41 43 48 49 4E 45 54 45 4E 44 45 52 2C 53 45 4D 49 43 4F 4E 44 55 43 54 4F 52 57 41 46 45 52 53 |
| Leonardo da Vinci (1452-1519; backwards) (references)
|
Binary Code (1918-1938, probably earlier) (references)01000011 01001100 01000101 01000001 01001110 01001001 01001110 01000111 00100000 01001101 01000001 01000011 01001000 01001001 01001110 01000101 00100000 01010100 01000101 01001110 01000100 01000101 01010010 00101100 00100000 01010011 01000101 01001101 01001001 01000011 01001111 01001110 01000100 01010101 01000011 01010100 01001111 01010010 00100000 01010111 01000001 01000110 01000101 01010010 01010011 |
HTML Code (1990) (references)C L E A N I N G   M A C H I N E   T E N D E R ,   S E M I C O N D U C T O R   W A F E R S |
ISO 10646 (1991-1993) (references)0043 004C 0045 0041 004E 0049 004E 0047 004D 0041 0043 0048 0049 004E 0045 0054 0045 004E 0044 0045 0052 002C 0053 0045 004D 0049 0043 004F 004E 0044 0055 0043 0054 004F 0052 0057 0041 0046 0045 0052 0053 |
Encryption (beginner's substitution cypher): (references)37463935484348412473537424348392543948383952142533947433749483855375449522573540395253 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
