Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Domain | Definition |
Occupations | Tends automatic bonding machine that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads: Reviews schematic diagram or work order to determine bonding specifications. Turns dials to set bonding machine temperature controls and to regulate wire feeding mechanism. Mounts spool of wire onto holder and inserts wire end through guides, using tweezers. Positions semiconductor package into magazine of automatic feed mechanism, and observes package, using microscope or equipment display screen, to ensure connections to be bonded are aligned with bonding wire. Adjusts alignment as necessary. Activates machine that automatically bonds wire to specified connections on semiconductor package leads. Removes packages from bonding machine and places packages in work tray. May test tensile strength of bonded connections, using testing equipment. May locate connections and bond wire to connect circuitry of hybrid circuits, using precision-bonding machine. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)42 4F 4E 44 45 52 2C 53 45 4D 49 43 4F 4E 44 55 43 54 4F 52 |
| Leonardo da Vinci (1452-1519; backwards) (references)
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Binary Code (1918-1938, probably earlier) (references)01000010 01001111 01001110 01000100 01000101 01010010 00101100 00100000 01010011 01000101 01001101 01001001 01000011 01001111 01001110 01000100 01010101 01000011 01010100 01001111 01010010 |
HTML Code (1990) (references)B O N D E R ,   S E M I C O N D U C T O R |
ISO 10646 (1991-1993) (references)0042 004F 004E 0044 0045 0052 002C 0053 0045 004D 0049 0043 004F 004E 0044 0055 0043 0054 004F 0052 |
Encryption (beginner's substitution cypher): (references)36494838395214253394743374948385537544952 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
