Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Domain | Definition |
Occupations | Assembles microelectronic semiconductor devices, components, and subassemblies according to drawings and specifications, using microscope, bonding machines, and handtools, performing any combination of following duties: Reads work orders and studies assembly drawings to determine operation to be performed. Observes processed semiconductor wafer under scribing machine microscope and aligns scribing tool with markings on wafer. Adjusts scribing machine controls, according to work order specifications, and presses switch to start scribing. Removes scribed wafer and breaks wafer into dice (chips), using probe. Places dice under microscope, visually examines dice for defects, according to procedures, and rejects defective dice. Positions mounting device on holder under bonding machine microscope, and adjusts bonding machine controls according to work order specifications. Positions die (chip) on mounting surface according to diagram. Presses switch on bonding machine to bond die to mounting surface. Places mounted die into holding fixture under microscope of lead bonding machine. Adjusts bonding machine controls according to work order specifications. Views die and moves controls to align and position bonding head for lead bonding according to diagram. Presses switch to bond lead and moves bonding head to points indicated in bonding diagram to attach and route leads as illustrated. Inserts and seals unprotected assembly into designated assembly container device, using welding machine and epoxy syringe, to protect microelectronic assembly and complete device, component, or subassembly package. Examines and tests assembly at various stages of production, using microscope, go-not-go test equipment, measuring instruments, pressure-vacuum tanks, and related devices, according to standard procedures, to detect nonstandard or defective assemblies. Rejects or routes nonstandard components for rework. Cleans parts and assemblies at various stages of production, using cleaning devices and equipment. Maintains records of production and defects. Bonds multiple dice to headers or other mounting devices. Important variations are kinds of equipment used, such as thermal compression, wedge, wire ball, and wobble bonders, items assembled, or procedure performed. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)41 53 53 45 4D 42 4C 45 52 2C 53 45 4D 49 43 4F 4E 44 55 43 54 4F 52 |
| Leonardo da Vinci (1452-1519; backwards) (references)
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Binary Code (1918-1938, probably earlier) (references)01000001 01010011 01010011 01000101 01001101 01000010 01001100 01000101 01010010 00101100 00100000 01010011 01000101 01001101 01001001 01000011 01001111 01001110 01000100 01010101 01000011 01010100 01001111 01010010 |
HTML Code (1990) (references)A S S E M B L E R ,   S E M I C O N D U C T O R |
ISO 10646 (1991-1993) (references)0041 0053 0053 0045 004D 0042 004C 0045 0052 002C 0053 0045 004D 0049 0043 004F 004E 0044 0055 0043 0054 004F 0052 |
Encryption (beginner's substitution cypher): (references)35535339473646395214253394743374948385537544952 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
