Cyanate resin composition and copper-clad laminate

Year	Description
1994	Invention patented by Yasuhiro Endo, Yoichi Ueda, Toshiaki Hayashi, Mitsuhiro Shibata, Shinichiro Kitayama, Shuichi Kanagawa, and Hisashi Watabu on February 22th, 1994. Abstract: A cyanate resin composition suitable for a copper-clad laminate comprises components (A) and (B). (A) a cyanate compound of the formula: ##STR1## wherein R and Q each represents halogen, C.sub.1-10 alkyl, C.sub.5-7 cycloalkyl or C.sub.6-20 hydrocarbon; i and j each represents 0-4 and M is (2): ##STR2## wherein T represents halogen, C.sub.1-10 alkyl, C.sub.5-7 cycloalkyl or C.sub.6-20 hydrocarbon; k represents 0-10 and m represents 0-8, and (B) a hardener.
Source: selected by the editor from original sources.

Invention: Cyanate resin composition and copper-clad laminate