Cube maskless lead open process using chemical mechanical polish/lead-tip expose process

Invention: Cube maskless lead open process using chemical mechanical polish/lead-tip expose process

Year	Description
1995	Invention patented by Timothy H. Daubenspeck, Steven J. Holmes, and Thomas G. Ference on June 4th, 1995. Abstract: A semi-conductor device having a conductive lead with an exposed tip disposed within a first insulative material, which is in turn disposed between insulated first and second integrated circuit chips is disclosed. The first insulative material is etched to form a recess after which a second insulative material is deposited on the access plane of the chips and within the recess. The tip of the wire lead is then exposed by either a chemical mechanical polish or by a wet etch/develop process.
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