Copyright © Philip M. Parker, INSEAD. Terms of Use.

| Year | Description |
| 1999 | Invention patented by Chandrasekhar Narayan, Edward W. Kiewra, Carl J. Radens, and Axel C. Brintzinger on January 3rd, 1999. Abstract: A fuse structure in an integrated circuit chip is described that includes an insulated semiconductor substrate; a fuse bank integral to the insulated semiconductor substrate consisting of a plurality of parallel co-planar fuse links; and voids interspersed between each pair of the fuse links, the voids extending beyond a plane defined by the co-planar fuse links. The voids surrounding the spot to be hit by a laser beam during fuse blow operation act as a crack stop to prevent damage to adjacent circuit elements or other fuse links present. By suitably shaping and positioning the voids, a tighter pitch between fuses may be obtained. |
| Source: selected by the editor from original sources. | |
Copyright © Philip M. Parker, INSEAD. Terms of Use.