Cladded material construction for etched-tri-metal circuits

  

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Cladded material construction for etched-tri-metal circuits

Invention: Cladded material construction for etched-tri-metal circuits

Year    Description
2000Invention patented by Achyuta Achari, Brenda Joyce Nation, Jay D Baker, Lakhi Nandlal Goenka, Mohan R. Paruchuri, and Vladimir Stoica on November 31th, 2000. Abstract: A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.
Source: selected by the editor from original sources.

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