Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame

Year	Description
2001	Invention patented by Kinji Saijo, Kazuo Yoshida, and Sinji Ohsawa on August 28th, 2001. Abstract: The present invention relates to a clad sheet for lead frame which can manufacture economically and has excellent characteristics, lead frame using thereof and manufacturing method thereof. A clad sheet for lead frame is manufactured by press-bonding copper foil to nickel foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding copper foil having nickel plating on one or both sides of it to the other copper foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding aluminum foil to nickel foil at the reduction rate of 0.1 to 3%. Further, it is also manufactured by press-bonding copper foil having nickel plating on one side of it to aluminum foil at the reduction rate of 0.1 to 3%. Clad sheet is comprising three layer of copper/nickel/copper or copper/nickel/aluminum.
Source: selected by the editor from original sources.

Invention: Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame