Copyright © Philip M. Parker, INSEAD. Terms of Use.

| Year | Description |
| 1991 | Invention patented by Mark A. Jaso, Paul B. Jones, Bernard S. Meyerson, and Vishnubhai V. Patel on October 29th, 1991. Abstract: Metallized semiconductor chips, such as are intended for VLSI, are coated with a first layer of SiO2 followed by a second layer of CVD diamond or DLC as an etch stop. The resulting structure is reproducibly and controllably planarized using a chem-mech slurry and an appropriate polishing pad, enabling subsequent layers to be built up similarly. |
| Source: selected by the editor from original sources. | |
Copyright © Philip M. Parker, INSEAD. Terms of Use.