Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Year | Description |
| 1999 | Invention patented by Takahiro Oka on June 2nd, 1999. Abstract: A board frame includes a wiring board region, which includes an island on which a semiconductor device is to be mounted; and a marginal region surrounding the wiring board region. The board frame further includes a frame region, which is located around the marginal region; and a support region which connects the wiring board region and the frame region. The marginal region is removed from the board frame and is put back to its original position, while the wiring board region is maintained being connected to the frame region through the support region. |
| Source: selected by the editor from original sources. | |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
