Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Year | Description |
| 1995 | Invention patented by Yukiharu Takeuchi and Shigetsugu Muramatsu on October 30th, 1995. Abstract: A semiconductor chip mounting board includes a base material made of resin; a metallized pattern formed on a surface of the base material which defines a die-pad area on which a semiconductor chip is to be mounted; and the metallized pattern comprising a plurality of zigzag shaped pattern lines along imaginary straight line segments radially, outwardly extending from a central position of the die-pad area. The metallized pattern may be a plurality of zigzag shaped pattern portions along imaginary concentric circles having a center at a central position of the die-pad area. Otherwise, the metallized pattern may be a plurality of closed loop shaped frames which are overlapped on each other in a zigzag manner. |
| Source: selected by the editor from original sources. | |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
