BGA socket with improved contacts

Year	Description
2001	Invention patented by Sidney Lu and Nick Lin on December 16th, 2001. Abstract: A BGA socket (1) comprises a base (20) defining a plurality of contact passageways (21), a plurality of contacts (30) received in the contact passageways, and a cover (10) movably mounted on the base. Each contact has a fitting portion (31) fixedly engaging with the base, a contact portion (32) formed above the fitting portion for engaging with a pin of an IC module, and a contact pad (33) below the fitting portion for being soldered to a printed circuit board. The bottom surface (331) of the contact pad has a plurality of bumps (332). A solder ball (34) is soldered to the bottom surface of the contact pad and bonded with the bumps.
Source: selected by the editor from original sources.

Invention: BGA socket with improved contacts