BGA pin isolation and signal routing process

Year	Description
1998	Invention patented by Michael C. Cilia, Don Nguyen, and Gurpreet S. Dayal on June 29th, 1998. Abstract: A method for isolating a pin of a ball grid array (BGA) device mounted on a printed circuit board, and routing the signal carried by the isolated pin to an alternate location. The BGA device pin is isolated by removing the solder ball to expose the device pad. A rework or engineering wire is then soldered to the BGA device pad using a high temperature solder. The rework wire is then routed between the other solder pads to the edge of the BGA device package. The BGA device is then reflowed at a temperature lower than the reflow temperature of the high temperature solder. The rework wire is used to route the signal carried by the isolated BGA pin to an alternate location. The present invention provides for higher process yields than conventional rework processes.
Source: selected by the editor from original sources.

Invention: BGA pin isolation and signal routing process