BGA package and method for fabricating the same

Year	Description
2000	Invention patented by Makoto Terui on March 20th, 2000. Abstract: A ball grid array (BGA) package includes a substrate (20) having first and second surfaces. and through holes (30) passing through it. The package further includes a first semiconductor chip (28) which is mounted on the first surface of the substrate (20); a second semiconductor chip (36) which is mounted on the second surface of the substrate (20); and solder balls (34) which are provided on the first surface of the substrate (20) and are electrically connected to the first semiconductor chip (28). The second semiconductor chip (36) is electrically connected via the through holes (30) to the solder balls (34).
Source: selected by the editor from original sources.

Invention: BGA package and method for fabricating the same