Copyright © Philip M. Parker, INSEAD. Terms of Use.

| Year | Description |
| 1996 | Invention patented by Siamak Jonaidi on February 22th, 1996. Abstract: A ball grid array (BGA) land pattern. In the present invention, a capture pad is disposed on a substrate. The capture pad is electrically coupled to a via which is formed into the substrate. A substantially rectangularly-shaped landing pad is also disposed on the substrate proximate to the capture pad. The substantially rectangularly-shaped landing pad is electrically coupled to the capture pad. In one embodiment, an electrically conductive connecting region electrically connects the substantially rectangularly-shaped landing pad to the capture pad. More specifically, the electrically conductive connecting region has a first end coupled to the capture pad and a second end coupled to the substantially rectangularly-shaped landing pad. |
| Source: selected by the editor from original sources. | |
Copyright © Philip M. Parker, INSEAD. Terms of Use.