Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Domain | Definition |
Occupations | Breaks semiconductor wafers into individual $T3dies,$T1 using equipment and handtools: Places semiconductor wafer on pad, using tweezers. Taps wafer, using pencil tip, awl, or tweezers to break wafer into quarters. Places semiconductor wafer quarter on plastic square. Presses semiconductor wafer, using roller or air pressure equipment, to break wafer quarter into individual dies. Places individual dies in containers, using vacuum wand or brush. May break wafers, using chemical solutions and breaking equipment. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)57 41 46 45 52 42 52 45 41 4B 45 52 2C 53 45 4D 49 43 4F 4E 44 55 43 54 4F 52 53 |
| Leonardo da Vinci (1452-1519; backwards) (references)
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Binary Code (1918-1938, probably earlier) (references)01010111 01000001 01000110 01000101 01010010 00100000 01000010 01010010 01000101 01000001 01001011 01000101 01010010 00101100 00100000 01010011 01000101 01001101 01001001 01000011 01001111 01001110 01000100 01010101 01000011 01010100 01001111 01010010 01010011 |
HTML Code (1990) (references)W A F E R   B R E A K E R ,   S E M I C O N D U C T O R S |
ISO 10646 (1991-1993) (references)0057 0041 0046 0045 0052 0042 0052 0045 0041 004B 0045 0052 002C 0053 0045 004D 0049 0043 004F 004E 0044 0055 0043 0054 004F 0052 0053 |
Encryption (beginner's substitution cypher): (references)57354039522365239354539521425339474337494838553754495253 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
