Copyright © Philip M. Parker, INSEAD. Terms of Use.
| Domain | Definition |
Occupations | Tends laminating machine that automatically bonds assembled layers of laminating materials and printed circuit board (PCB) panels to form multilayer PCB panels: Reads instruction sheet to determine specified materials and laminating procedures. Assembles inner and outer layers of PCB panels and laminating materials over guide pins of holding fixture. Places assembled boards on bay (shelf) of machine. Turns controls to set time, pressure, and temperature of laminating machine according to specifications. Starts laminating machine that applies pressure and heat to bond materials and form multilayer PCB panels. Monitors machine operation and adjusts machine controls to maintain specified temperature and pressure. May compute pressure level for laminating machine. May heat materials in oven to remove moisture or condition materials prior to laminating process. (references) |
Source: compiled by the editor from various references; see credits. | |
Hexadecimal (or equivalents, 770AD-1900s) (references)4C 41 4D 49 4E 41 54 4F 52 2C 50 52 49 4E 54 45 44 43 49 52 43 55 49 54 42 4F 41 52 44 53 |
| Leonardo da Vinci (1452-1519; backwards) (references)
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Binary Code (1918-1938, probably earlier) (references)01001100 01000001 01001101 01001001 01001110 01000001 01010100 01001111 01010010 00101100 00100000 01010000 01010010 01001001 01001110 01010100 01000101 01000100 00100000 01000011 01001001 01010010 01000011 01010101 01001001 01010100 00100000 01000010 01001111 01000001 01010010 01000100 01010011 |
HTML Code (1990) (references)L A M I N A T O R ,   P R I N T E D   C I R C U I T   B O A R D S |
ISO 10646 (1991-1993) (references)004C 0041 004D 0049 004E 0041 0054 004F 0052 002C 0050 0052 0049 004E 0054 0045 0044 0043 0049 0052 0043 0055 0049 0054 0042 004F 0041 0052 0044 0053 |
Encryption (beginner's substitution cypher): (references)463547434835544952142505243485439382374352375543542364935523853 |
| 1. Orthography 2. Bibliography |
Copyright © Philip M. Parker, INSEAD. Terms of Use.
